Suzhou Smacon Automation Technology Co., Ltd.(referred to as “Smacon”) is an advanced automation manufacturing enterprise, established in 2004, specializing in efficient and intelligent equipment and production lines for electronic semiconductors, biomedicine (+instruments).

Smacon is committed to improving social productivity, and wherever there is production, there are our equipment and services.

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Flip Chip Die Bonder

Model:MAT201FC

Application Scenarios:Enables high-density electrical interconnections for CPUs, GPUs, memory chips, and System-in-Package (SiP) modules, enhancing performance and integration levels.

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Model Number:MAT201FC

Application Scenarios: Enables high-density electrical interconnections for CPUs, GPUs, memory chips, and System-in-Package (SiP) modules, enhancing performance and integration levels.

Placement Accuracy:±1.5μm@3σ ,θ+/-0.1°

UPH:>2

Die Size Range:0.3-5mm

Feeding System: Fully automatic loading/unloading with magazine input and auto-adjusting conveyor width

Features:

  • Automatic switching among up to 3 ejector pin assemblies

  • Pick force controlled at 30-300g (±5g) with closed-loop feedback

  • Auto-quick-change nozzle system (12-nozzle magazine capacity)

  • Integrated flux dipping system

  • Standard wafer map formats (SEMI G85) applicable

  • Ink dot recognition and AI-based die defect similarity matching

Equipment Dimensions (L*W*H) (1330 L × 1550 W × 1750 H)

Electronics Semiconductor Biopharmaceutical and Medical Device Production Systems Other Automation Series

0512-65265667

18015580975

18015580976

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