Suzhou Smacon Automation Technology Co., Ltd.(referred to as “Smacon”) is an advanced automation manufacturing enterprise, established in 2004, specializing in efficient and intelligent equipment and production lines for electronic semiconductors, biomedicine (+instruments).
Smacon is committed to improving social productivity, and wherever there is production, there are our equipment and services.
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/ 3Model:MAT201FC
Application Scenarios:Enables high-density electrical interconnections for CPUs, GPUs, memory chips, and System-in-Package (SiP) modules, enhancing performance and integration levels.
Contact usModel Number:MAT201FC
Application Scenarios: Enables high-density electrical interconnections for CPUs, GPUs, memory chips, and System-in-Package (SiP) modules, enhancing performance and integration levels.
Placement Accuracy:±1.5μm@3σ ,θ+/-0.1°
UPH:>2
Die Size Range:0.3-5mm
Feeding System: Fully automatic loading/unloading with magazine input and auto-adjusting conveyor width
Features:
Automatic switching among up to 3 ejector pin assemblies
Pick force controlled at 30-300g (±5g) with closed-loop feedback
Auto-quick-change nozzle system (12-nozzle magazine capacity)
Integrated flux dipping system
Standard wafer map formats (SEMI G85) applicable
Ink dot recognition and AI-based die defect similarity matching
Equipment Dimensions (L*W*H) (1330 L × 1550 W × 1750 H)
Pre:High-Precision Micro-Assembly Multi-Die Bonder
Next:None!
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