Suzhou Smacon Automation Technology Co., Ltd.(referred to as “Smacon”) is an advanced automation manufacturing enterprise, established in 2004, specializing in efficient and intelligent equipment and production lines for electronic semiconductors, biomedicine (+instruments).

Smacon is committed to improving social productivity, and wherever there is production, there are our equipment and services.

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High-Precision Micro-Assembly Multi-Die Bonder

Model:MAT120

Application Scenarios:Power device mounting, advanced-stage SiP die stacking, and precision bonding for CMOS/MEMS components

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Model Number: MAT120

Application Scenarios: Power device mounting, advanced-stage SiP die stacking, and precision bonding for CMOS/MEMS components

Placement Accuracy:±5um@3σ ,θ+/-0.1°

UPH:>1.5

Die Size Range:0.3~15mm

Pick-and-Place Head / Nozzles: 1 pick module with 3 nozzle tips

Feeding System: Industry-standard waffle packs and film frame cassettes

Features:

  • Automatic switching among up to 3 ejector pin assemblies

  • Programmable pick force: 30-300g (±5g)

  • Optional alcohol spray unit for enhanced surface activation

  • Supports standard wafer map formats (SEMI G85)

  • Ink dot recognition with >99.9% accuracy

  • AI-powered die defect similarity matching

Equipment Dimensions (L*W*H) (1650 L ×1350 W ×1700 H)

Electronics Semiconductor Biopharmaceutical and Medical Device Production Systems Other Automation Series

0512-65265667

18015580975

18015580976

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