Suzhou Smacon Automation Technology Co., Ltd.(referred to as “Smacon”) is an advanced automation manufacturing enterprise, established in 2004, specializing in efficient and intelligent equipment and production lines for electronic semiconductors, biomedicine (+instruments).
Smacon is committed to improving social productivity, and wherever there is production, there are our equipment and services.
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Model：DB130
Application Scenarios：SiP packaging, Memory Stack Die assembly, CMOS/MEMS bonding processes
Contact usModel: DB130
Application Scenarios: SiP packaging, Memory Stack Die assembly, CMOS/MEMS bonding processes
Placement Accuracy: ±20μm @3σ, θ±0.1°
UPH: >3,000
Die Size Range: 0.3 mm to 15 mm
Pick-and-Place Head/Nozzle: Single-nozzle operation; Single/Dual dispensing heads
Feeding System: Fully automatic loading/unloading (magazine input)
Features:
Compatible with Waffle Packs, Trays, and Carriers
Programmable pick force: 30-300g (±5g)
Standard wafer map formats (SEMI G85) applicable
Ink dot recognition and AI-based die defect similarity identification
Dimensions (L*W*H) (1300 L×1550 W×1750 H)
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