Suzhou Smacon Automation Technology Co., Ltd.(referred to as “Smacon”) is an advanced automation manufacturing enterprise, established in 2004, specializing in efficient and intelligent equipment and production lines for electronic semiconductors, biomedicine (+instruments).
Smacon is committed to improving social productivity, and wherever there is production, there are our equipment and services.
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Model：WPS601
Application Scenarios：Ideal for SiP packaging, Memory Stack Die assembly, CMOS/MEMS bonding, and related advanced processes
Contact usModel Number: WPS601
Application Scenarios: Ideal for SiP packaging, Memory Stack Die assembly, CMOS/MEMS bonding, and related advanced processes
Placement Accuracy：±15μm@3σ ，θ+/-0.1°
UPH：>8
Wafer Loading: Supports 6-inch and 8-inch wafers
Tray Module Tray Size: 2-inch、 4-inch
Die Size Range: 0.3 mm to 15 mm
Pick-and-Place Head / Nozzle: Single-nozzle pick-and-place operation
Feeding System: Fully automatic loading/unloading with magazine input
Features:
Die feeding compatibility with Waffle Packs, Trays, and Carriers
Programmable pick force: 30-300g (±5g) closed-loop control
Standard wafer map compatible
Ink dot identification
AI-based die defect similarity identification
Equipment Dimensions (L*W*H) (1300 L × 1550 W × 1750 H)
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