Suzhou Smacon Automation Technology Co., Ltd.(referred to as “Smacon”) is an advanced automation manufacturing enterprise, established in 2004, specializing in efficient and intelligent equipment and production lines for electronic semiconductors, biomedicine (+instruments).
Smacon is committed to improving social productivity, and wherever there is production, there are our equipment and services.
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/ 3Model:MAT306
Application Scenarios:Suitable for IGBT, SiC, MOSFET, sensors, memory chips stacking and mounting processes
Contact usModel: MAT306
Application Scenarios: Suitable for IGBT, SiC, MOSFET, sensors, memory chips stacking and mounting processes
Placement Accuracy:±10μm @3σ, θ±0.1°
UPH: >3,000
Die Size Range: 0.3 mm to 15 mm
Pick-and-Place Head/Nozzle: 6 nozzles with auto-change system (12-nozzle magazine capacity)
Component Feeding:
6/8/12-inch wafer rings
Bulk material flexible vibratory feeders
3× 2-inch/4-inch trays
3× in-line solder wire cutting units
Features:
Automatic switching among up to 3 ejector pin assemblies
Programmable pick force: 30-300g (±5g)
Optional alcohol spray unit
Standard wafer map formats applicable
Ink dot recognition and die defect similarity identification
Dimensions (L*W*H) (1420 L×1750 W×1750 H)
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