Suzhou Smacon Automation Technology Co., Ltd.(referred to as “Smacon”) is an advanced automation manufacturing enterprise, established in 2004, specializing in efficient and intelligent equipment and production lines for electronic semiconductors, biomedicine (+instruments).

Smacon is committed to improving social productivity, and wherever there is production, there are our equipment and services.

Electronics Semiconductor

Products

Advanced manufacturing automation equipment high-tech enterprise, specializing in efficient intelligent equipment and production lines for electronic semiconductors, biomedicine (+medical devices).

High-Precision Automated GT Pre-encapsulation System

Model:GT100

Application:Fully automatic high-precision lamination of flexible films onto die-arrayed substrates

Single-Module High-Speed Tray Loading System

Model:PP140DI

Application:Oriented placement of bulk SMD components into Trays or Wafers

Fully Automatic High-Speed Hybrid Mounter

Model:MAT306

Application:Suitable for IGBT, SiC, MOSFET, sensors, memory chips stacking and mounting processes

Lead Forming & Inspection System

Model:ADC200

Application:Lead forming and coplanarity inspection for SMD transistor products

TSA Film Laminator

Model:TSA100

Application:Laminates flexible films onto substrates with arrayed dies

In-line High-Speed Tray Loading/Mounting/Assembly Machine

Model:iPP213

Application:Oriented placement of bulk SMD components into conveyor-based Trays

Fully Automatic High-Speed Handler

Model:WPS601

Application:Ideal for SiP packaging, Memory Stack Die assembly, CMOS/MEMS bonding, and related advanced processes

Coplanarity Inspection Platform

Model:CoP10

Application:Lead coplanarity inspection for SMD transistor products

Semi-Automatic Film Delaminator

Model:TSA150

Application:Delaminates films from finished reels onto specific frames

Tray Loading/Inverting Machine

Model:PP120

Application:Integrated system for automatic SMD/DIP component handling and tray loading/unloading with interchangeable functions

Fully Automatic High-Speed Die Bonder

Model:DB130

Application:SiP packaging, Memory Stack Die assembly, CMOS/MEMS bonding processes

16-Channel Tester

Model:CM130P

Application:PTC charging test with lead forming/cutting

Electronics Semiconductor Biopharmaceutical and Medical Device Production Systems Other Automation Series

0512-65265667

18015580975

18015580976

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