Suzhou Smacon Automation Technology Co., Ltd.(referred to as “Smacon”) is an advanced automation manufacturing enterprise, established in 2004, specializing in efficient and intelligent equipment and production lines for electronic semiconductors, biomedicine (+instruments).

Smacon is committed to improving social productivity, and wherever there is production, there are our equipment and services.

Products

Advanced manufacturing automation equipment high-tech enterprise, specializing in efficient intelligent equipment and production lines for electronic semiconductors, biomedicine (+medical devices).

Fully Automatic High-Speed Hybrid Mounter

Model:MAT306

Application:Suitable for IGBT, SiC, MOSFET, sensors, memory chips stacking and mounting processes

Fully Automatic High-Speed Handler

Model:WPS601

Application:Ideal for SiP packaging, Memory Stack Die assembly, CMOS/MEMS bonding, and related advanced processes

Fully Automatic High-Speed Die Bonder

Model:DB130

Application:SiP packaging, Memory Stack Die assembly, CMOS/MEMS bonding processes

High-Precision Micro-Assembly Multi-Die Bonder

Model:MAT120

Application:Power device mounting, advanced-stage SiP die stacking, and precision bonding for CMOS/MEMS components

Flip Chip Die Bonder

Model:MAT201FC

Application:Enables high-density electrical interconnections for CPUs, GPUs, memory chips, and System-in-Package (SiP) modules, enhancing performance and integration levels.

Wafer Inkjet Printer

Model:Wafer-IM2.0

Application:Inkjet marking on 8-inch bare wafers and framed wafer surface

Electronics Semiconductor Biopharmaceutical and Medical Device Production Systems Other Automation Series

0512-65265667

18015580975

18015580976

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